| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component bonding device that does not damage the quality of an electronic component by suppressing the occurrence of vertical flexural vibrations. SOLUTION: In this electronic component bonding device which press-fixes the electronic component to a substrate by imparting vibrations to the component while pressing the component against the substrate by means of a bonding tool 14, a fixing seat 15a which fixes the tool 14 to a block 13 which moves upward and downward with respect to the substrate is provided at the position corresponding to the antinode of the standing wave of the vibration of a horn 15, and the seat 15a and the main body section of the horn 15 are connected to each other through a connecting section A having a thin cross section and vertically symmetrical notched sections B. Consequently, the flexural rigidity of the cross section of the connecting section A can be reduced, and the occurrence of the vertical displacement of the horn 15 caused by flexural vibrations excited in a fixing section can be suppressed by suppressing the transmission of the flexural vibrations to the main body of the horn 15. COPYRIGHT: (C)2004,JPO
|
