FREEZE-CHUCKING METHOD AND DEVICE IN LASER CUTTING

摘要

PROBLEM TO BE SOLVED: To provide a laser cutting device in which a substrate to be processed is held and cooled with ice when the substrate is cut by a laser.

SOLUTION: This a freeze-chucking device for laser cutting in which the substrate 6 to be processed is cooled on one side while the other side is irradiated with and cut by the laser. The device is equipped with a Peltier element 4, a placing plate 5 provided on the Peltier element, and a water feeding means for supplying water to the placing plate. The device has a structure such that the substrate 6 is held and cooled with ice on the placing plate.

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