| 摘要 |
A method of transferring multiple devices arrayed on a first substrate to a second substrate is provided. The devices on the first substrate are covered with a release agent, and a portion of the release agent, positioned on a device to be transferred is selectively removed. The first substrate is placed on a second substrate in such a manner that the devices arrayed on the first substrate face an adhesive layer previously provided on the second substrate. Only the device from which the release agent has been removed, is irradiated with a laser beam from a back side of the first substrate. The second substrate is then peeled from the first substrate, whereby only the device to be transferred is certainly, efficiently, and accurately transferred from the first substrate to the second substrate.
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