发明名称 |
METHOD FOR FABRICATING SILICON OXIDE LAYER BY ATOMIC LAYER DEPOSITION METHOD |
摘要 |
PURPOSE: A method for fabricating a silicon oxide layer by an atomic layer deposition(ALD) method is provided to increase the deposition rate of a silicon oxide layer while improving the quality of a layer by using a new silicon source and/or catalyst. CONSTITUTION: The first reactant of halogenated silicon including at least two silicon atoms is supplied to a substrate to which a hydroxy radical is coupled together with the first base catalyst so that a chemisorbed layer of the first reactant is formed on the substrate(132). The second reactant containing O and H is supplied to the chemisorbed layer together with the second base catalyst so that the chemisorbed layer of the first reactant chemically reacts with the second reactant(136).
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申请公布号 |
KR20040005568(A) |
申请公布日期 |
2004.01.16 |
申请号 |
KR20030006370 |
申请日期 |
2003.01.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOO, GANG SU;LEE, JU WON;PARK, JAE EON;YANG, JONG HO |
分类号 |
H01L21/205;C23C16/40;C23C16/44;C23C16/455;H01L21/312;H01L21/314;H01L21/316;H01L21/76;(IPC1-7):H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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