发明名称 METHOD FOR FABRICATING SILICON OXIDE LAYER BY ATOMIC LAYER DEPOSITION METHOD
摘要 PURPOSE: A method for fabricating a silicon oxide layer by an atomic layer deposition(ALD) method is provided to increase the deposition rate of a silicon oxide layer while improving the quality of a layer by using a new silicon source and/or catalyst. CONSTITUTION: The first reactant of halogenated silicon including at least two silicon atoms is supplied to a substrate to which a hydroxy radical is coupled together with the first base catalyst so that a chemisorbed layer of the first reactant is formed on the substrate(132). The second reactant containing O and H is supplied to the chemisorbed layer together with the second base catalyst so that the chemisorbed layer of the first reactant chemically reacts with the second reactant(136).
申请公布号 KR20040005568(A) 申请公布日期 2004.01.16
申请号 KR20030006370 申请日期 2003.01.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOO, GANG SU;LEE, JU WON;PARK, JAE EON;YANG, JONG HO
分类号 H01L21/205;C23C16/40;C23C16/44;C23C16/455;H01L21/312;H01L21/314;H01L21/316;H01L21/76;(IPC1-7):H01L21/205 主分类号 H01L21/205
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