发明名称 METHOD AND APPARATUS FOR PLASMA TREATMENT, AND TRAY FOR PLASMA TREATMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and apparatus for plasma treatment by which the temperature controllability of a substrate is improved, and to provide a tray for plasma treatment. <P>SOLUTION: A vacuum chamber is evacuated by a pump while a predetermined gas is supplied to the chamber by a gas supply apparatus. A plasma is generated in the chamber by applying high frequency power from a high frequency power supply for coil to a coil while the pressure of the chamber is controlled to be at a predetermined level. Thus, a substrate mounted on a substrate electrode is subjected to plasma treatment. At this time, an adhesive sheet is provided between the substrate electrode and the substrate and thus the temperature controllability can be improved. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004006300(A) 申请公布日期 2004.01.08
申请号 JP20030104066 申请日期 2003.04.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OKUMURA TOMOHIRO;NITTA TOSHIYA
分类号 H05H1/46 主分类号 H05H1/46
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