发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive-working resist composition which exhibits sufficient transparency during the use of a light source of &le;160 nm, specifically an F<SB>2</SB>excimer laser beam (157 nm), has high sensitivity, high resolution and excellent coating property. <P>SOLUTION: The positive-working resist composition comprises: a resin which contains a repeating unit (A1) having at least two groups expressed by (1) and is alkali-soluble or is decomposed by the effect of an acid to increase its solubility in an aqueous alkaline solution; and a compound which generates an acid by the effect of active ray or radiation. In the formula (1), R<SP>50</SP>to R<SP>55</SP>each independently denotes a hydrogen atom, a fluorine atom or an optionally substituted alkyl group, provided that at least one among R<SP>50</SP>to R<SP>55</SP>is an a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom. R denotes a hydrogen atom or an organic group. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004004576(A) 申请公布日期 2004.01.08
申请号 JP20030049203 申请日期 2003.02.26
申请人 FUJI PHOTO FILM CO LTD 发明人 SASAKI TOMOYA;MIZUTANI KAZUYOSHI;KANNA SHINICHI
分类号 G03F7/039;C08F212/14;H01L21/027 主分类号 G03F7/039
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