发明名称 Chip card having a contact zone and process for producing such a chip card
摘要 <p>A chip card has a contact zone on which an electrically conductive lacquer applied. The electrically conductive lacquer is based on an intrinsically conductive plastic material. Pigments are added to the electrically conductive lacquer. In an alternative embodiment an electrically nonconductive lacquer is applied to the contact zone. Conductive particles are disposed in the electrically nonconductive lacquer. The electrically conductive lacquer forms a covering for the conductive particles. A method of lacquering a contact zone and a method of producing a chip card are also provided.</p>
申请公布号 IN191740(B) 申请公布日期 2003.12.20
申请号 IN1782CA1997 申请日期 1997.09.24
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 THIES JANCZEK;STAMPKA PETER
分类号 G06K19/077;H05K1/14;H05K3/28;H05K3/30;(IPC1-7):C06K5/00;B05D5/00;B05D5/12;B32D9/04 主分类号 G06K19/077
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