METHOD FOR INSPECTING DEFECT OF WAFER IN SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for inspecting a defect of a wafer in a semiconductor device is provided to reduce an interval of inspection time and sort a wafer defect in each die by establishing normal coordinates in each die of the wafer. CONSTITUTION: A defect analysis system includes an inspection station unit for detecting a defect generated in the wafer(400) and a review system for reinspecting the defect. Each die(401) of the wafer with a plurality of dies is supplied with a serial number. The plane of each die becomes coordinates with respect to a corner of each die.