| 摘要 |
Provided is a method of manufacturing a printed wiring board which keeps a good etching factor of formed circuits, eliminates an etching residue and can effectively prevent the occurrence of surface layer migration. In the method of manufacturing a printed wiring board which involves using a copper-clad laminate, which is fabricated by bonding together a conductive-circuit formation layer obtained by laminating a copper layer and a dissimilar metal layer other than copper, and an insulating base material so that the copper layer of the conductive-circuit formation layer is exposed to the surface, the above etching of the conductive-circuit formation layer includes a primary etching step of simultaneously dissolving the copper layer and the dissimilar metal layer other than copper which form the conductive-circuit formation layer and a secondary etching step which involves using, after the completion of the primary etching step, a selective etching solution to dissolve only metals which constitute the dissimilar metal layer without dissolving copper.
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