Method for manufacturing high density electrical connector assembly

摘要

A method for manufacturing an electrical connector assembly (100) comprises the steps of: (a) providing a plurality of first wafers (21) each having a first block (25) and a second block (26) disposed on opposite surfaces; (b) inserting terminals (23) into corresponding first wafers and inserting a plurality of grounding buses (24) between every two adjacent first wafers to defines a first spacer (20), each grounding bus including a body portion and a contacting legs (242) on the surfaces of corresponding first spacer; (c) inserting a plurality of circuit boards (30) into slots (27) between the first wafers, in which the circuit boards electrically engage the grounding buses; (d) bringing the first spacer and the circuit boards into a housing (10) to form a receptacle (1); (e) repeating the steps (a) to (d) to form a second spacer (90) having identical structure with the first spacer; and (f) inserting the second spacer into a second housing (82) to form a header (8), inserting the header into the receptacle to electrically connect each other thereby forming the electrical connector assembly.