Flip chip package

摘要

A flip chip package has a substrate (14) made of a material including an epoxy resin. A solder mask (30) is one layer of an epoxy resin disposed on the top surface of the substrate (14). The solder mask (30) has a smooth outer surface and a plurality of openings (34) to expose the conductive patterns (24) formed on the top surface. An IC chip (12) includes an active side having a plurality of electrical contact pads (22). A plurality of solder bumps (36), each bump (36) is formed on a respective one of the plurality of contact pads (22) on the IC chip. The active side of the IC chip is tightly attached to the outer surface of the solder mask (30) such that after a soldering process each said bump (36) has a remainder (36a) completely received in a respective one of the opening of the solder mask (30) and connected to the conductive patterns therein.