| 摘要 |
<p>The invention relates to a cooling device (1) for cooling one or more power semiconductor components (20, 20'), comprising a flat, copper, plate-type hollow body (10) for conducting a coolant fluid (3). Components are fixed on one flat-sided surface (101) of the hollow body and the other flat-sided surface (102) comprises two coolant fluid openings (11) for introducing the coolant fluid into the hollow body and for evacuating said fluid from the same, said other flat-sided surface being concave and elastically deformable between the coolant fluid openings. Said device also comprises a fixing device (5) for fixing the concave other surface to the even surface (41) of a support (4) in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut (60), which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The invention relates to a module (1') consisting of said cooling device and an assembly (1'', 1''') comprising the cooling device or module and a support. The device is used for electric transmissions, in particular of motor vehicles.</p> |
