| 摘要 |
The invention concerns a copper-based circuit having an electrically insulative substrate, a bond layer including silver formed over select portions of the substrate according to a desired shape of the circuit, and an electrically conductive layer including plastically deformed particles of copper deposited on the bond layer. Furthermore, the invention also concerns a process for forming a copper-based circuit, wherein the process includes the steps of providing an electrically insulative substrate, forming a bond layer including silver over select portions of the substrate according to a desired shape of the circuit, and depositing copper on the bond layer by the steps of introducing copper particles into a pressurized carrier gas, forming the pressurized carrier gas and the copper particles into a supersonic jet, and directing the jet toward the bond layer formed over the substrate such that the jet has a velocity sufficient to cause plastic deformation of the copper particles onto the bond layer, thereby forming an electrically conductive layer on the bond layer.
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