An IC tag includes a first adhesive layer formed on a surface of a sub substrate sheet, an electronic circuit and an IC chip connecting both ends of the electronic circuit, both formed on the surface of the first adhesive layer, and a second adhesive layer covering the electronic circuit and the IC chip. The IC tag further includes a peeling agent layer formed at positions corresponding to the both ends of the electronic circuit and located at the boundary between the substrate sheet and the first adhesive layer. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
