发明名称 IC TAG
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an IC tag enabling an incorporated electronic circuit to be surely broken if the IC tag affixed on an article is peeled off. <P>SOLUTION: In the IC tag, a first adhesive agent layer is stuck on the surface of a base material sheet, and IC chips for connecting electronic circuit and both terminals of the electronic circuits are installed on the surface of the adhesive agent layer. Also a second adhesive agent layer is stacked to cover the electronic circuit and the IC chips. A peeling agent layer is installed in a boundary between the base material sheet and the first adhesive agent layer at positions corresponding to both end part of the electronic circuit. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003331248(A) 申请公布日期 2003.11.21
申请号 JP20020140535 申请日期 2002.05.15
申请人 LINTEC CORP 发明人 YAMAKAGE MASATERU;TAGUCHI KATSUHISA;HASEGAWA TOMOYUKI;TAKAHARA TORU
分类号 B42D15/10;G06K19/07;G06K19/073;G06K19/077;(IPC1-7):G06K19/077 主分类号 B42D15/10
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