| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which excels in crack resistance at high temperatures and humidity-resistant reliability when a semiconductor device of the surface mounting type is sealed. SOLUTION: The resin composition for sealing comprises (A) an epoxy resin represented by the formula (wherein (n) is an integer of≥1), (B) a xylene resin modified phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a coupling agent as the essential components. A semiconductor device is obtained by sealing a semiconductor chip with a cured product of this resin composition for sealing. COPYRIGHT: (C)2004,JPO
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