发明名称 |
SEALING EPOXY RESIN MOLDING MATERIAL AND ELECTRONIC COMPONENT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a sealing epoxy resin material which contains a metal oxide or a metal hydroxide and shows excellent moldability and an electronic component device equipped with an element sealed with this. SOLUTION: The sealing epoxy resin molding material essentially comprises (A) an epoxy resin, (B) a hardener and (C) the metal oxide or the metal hydroxide treated with a releasing agent which is a higher aliphatic compound having a carbon number of≥25. The electronic component device is equipped with the element sealed with this material. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2003327791(A) |
申请公布日期 |
2003.11.19 |
申请号 |
JP20020140919 |
申请日期 |
2002.05.16 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
WATANABE HISANORI;KASHIWABARA TAKAYOSHI;YAMADA SHINYA;ISHIGURO TADASHI |
分类号 |
C08L63/00;C08G59/62;C08K3/00;C08K9/04;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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