| 摘要 |
PROBLEM TO BE SOLVED: To overcome the problem that capability for detecting a defective unit mark in a post-process for manufacturing a semiconductor wafer is degraded due to a fluctuation in the size and color strength of the mark in a marking method in a conventional wafer inspection. SOLUTION: While a cylindrical thermoplastic resin having a thickness of 10-100μm and a size of 80-800μm is used as a mark material for inspection, the mark material for inspection is approached to a hot plate 2 to melt one surface of the resin 1, and the mark material having a melted surface for inspection is stuck to a defective chip of the wafer 3. COPYRIGHT: (C)2004,JPO
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