| 摘要 |
PURPOSE: A failure analysis apparatus and method of a semiconductor device are provided to be capable of simply checking the main failure factor of each failure bit mode corresponding to a test mode per each wafer. CONSTITUTION: A failure analysis apparatus of a semiconductor device is provided with a wafer map memory(102), a block(104) for calculating the number and rate of failure dies, a D/S(Die/Sorting) and FBM(Fail Bit Map) calculating block(106), a control block(108), and a memory block(110). The failure analysis apparatus of a semiconductor device further includes the first failure die rate calculating block(112), the second failure die rate calculating block(114), an expected FBM and D/S calculating block(116), a mean D/S yield calculating block(118), a maximum and minimum yield calculating block(120), and a monitor(122).
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