发明名称 RESIN SEALING AND MOLDING METHOD FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent a wire 16 electrically connecting an electronic component 4 to a lead from being cut or deformed with satisfactory efficiency by a method wherein when the electronic component 4 mounted on a lead frame 5 by using a resin sealing and molding metal mold composed of a fixed cope 2 and a movable drag 3 is resin-sealed and molded, carbon dioxide gas having affinity and plasticity with respect to a resin is dissolved in a molten resin so as to lower the viscosity of the molten resin. SOLUTION: First, both the fixed cope 2 and the movable drag 3 are clamped, the electronic component is fitted and set inside both an upper cavity 7 and a lower cavity 8, the carbon dioxide gas is pressure-fed and introduced by a carbon-dioxide-gas pressure feed mechanism 18 into at least a pot 11 including a cull 13 in the metal mold, a resin passage 14 and both cavities 7, 8, and the molten resin is injected and filled into both cavities 7, 8. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003309137(A) 申请公布日期 2003.10.31
申请号 JP20020111161 申请日期 2002.04.12
申请人 TOWA CORP 发明人 OSADA MICHIO;KITADA RYOJI
分类号 B29C45/02;B29C45/14;B29C45/17;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/02
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