| 摘要 |
FIELD: radio electronics, instrumentation engineering, and other industries; junction block and printed-circuit board manufacture. SUBSTANCE: junction block has base in the form of non- foiled dielectric strip and contact pads with current-conducting leads disposed in strip depressions protruding beyond strip for their forming. Method for manufacturing junction block using standard printed-circuit boards in packaged design blocks with miniature board-to-board connectors includes making depressions on base in the form of non-foiled dielectric strip to receive contact pads and current-conducting leads, removing copper from external surfaces of strip, whereupon auxiliary part of strip provided with depressions for current-conducting leads is removed, all copper-plated surfaces are run over with solder, and current-conducting leads are formed. EFFECT: reduced size and mass of package design blocks. 12 cl, 3 dwg
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