发明名称 HOT PLATE AND CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a hot plate equipped with a conductive pattern with little bulge, with excellent adhesiveness and with large specific resistance. SOLUTION: The hot plate 3 uses a nitride ceramic board 9 equipped with conductive patterns 10, 10a. The conductive patterns 10, 10a consist of ruthenium oxide, bismuth or its oxide, glass frit and precious metal particles. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003303664(A) 申请公布日期 2003.10.24
申请号 JP20030032947 申请日期 2003.02.10
申请人 IBIDEN CO LTD 发明人 SHU ENREI
分类号 H05B3/20;H01L21/02;H01L21/027;H05B3/10;H05B3/12;H05B3/14;H05B3/74;(IPC1-7):H05B3/12 主分类号 H05B3/20
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