METHOD FOR PRODUCING A HOUSING FOR A CHIP HAVING A MICROMECHANICAL STRUCTURE

摘要

The invention relates to a method for producing a housing, whereby a base comprising first contacts is provided with a layer which can be photolithographically structured in such a way as to uncover the contacts. A chip which has a micromechanical structure located between second contacts on said chip is provided with a layer which can be photolithographically structured in such a way as to create a recess in the region of the micromechanical structure and in the region of the second contacts. Once the base and the chip have been joined, the base is etched off.