发明名称 INDUCTIVELY COUPLED PLASMA ASSISTED ION PLATING SYSTEM
摘要 PURPOSE: An inductively coupled plasma assisted ion plating system for manufacturing a protection coating having superior corrosion resistance and wear resistance at high speed is provided. CONSTITUTION: The ion plating system comprises a chamber(10) to one side of which vacuum means for forming vacuum is connected, and to the other side of which source for forming plasma is supplied; at least one source supply part(42) connected to the chamber to supply at least one source for forming plasma; an evaporation means(16) installed at one end of the chamber to evaporate sample(40); a substrate holder installed at the opposite side of the evaporation means inside the chamber so that a substrate is mounted on the substrate holder; a shutter installed between the evaporation means and substrate to control flow of the sample evaporated from the evaporation means; an RFI (radio frequency interference) coil(34) installed between the substrate(44) and shutter to promote chemical synthesis and increase coherence for the substrate by forming RF (radio frequency) electromagnetic field, thereby changing the source supplied through the source supply part and sample evaporated from the evaporation means into the plasma state; an RF (radio frequency) supply part(30) for supplying RF power to the RFI coil; a DC (direct current) anode part(38) separately which is installed at the rear surface of the substrate, and to which the anode of DC is connected so that the DC anode part electrifies the rear surface of the substrate with negative electric charge; and a DC supply part(36) for supplying a DC voltage to the DC anode part.
申请公布号 KR20030082344(A) 申请公布日期 2003.10.22
申请号 KR20020021014 申请日期 2002.04.17
申请人 LEE, JUNG JOONG 发明人 LEE, JUNG JOONG;JUNG, SEUNG JAE
分类号 C23C14/48;(IPC1-7):C23C14/48 主分类号 C23C14/48
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