| 摘要 |
PROBLEM TO BE SOLVED: To provide as a socket of excellent electric characteristics and easy to manufacture, for use in mounting a semiconductor element or a semiconductor device. SOLUTION: With the socket for electronic components mounting the electronic components in free demounting in interposition between the electronic components such as semiconductor elements or semiconductor devices and a mounting board and electrically connecting the electronic components and the mounting board, connecting terminals 52 with a conductive film 36 formed on the outer surface of resin bump 51a fitted in protrusion from a socket main body 51 integrated with it are arranged on a mounting side of the socket main body made of resin, and a contact terminal 40 each is arranged with a base end joined with an inside face of the conductive film 36, and the base end side sealed by being buried in the resin bump 52 and the socket main body 51, and at the same time, with its tip side formed in extension in a curved shape from a side contrary to the mounting face of the socket main body. COPYRIGHT: (C)2004,JPO
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