发明名称 COVER STRUCTURE AND FORMING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a cover structure in which work during manufacture is easy, which is advantageous in terms of cost and in which an electromagnetic wave can securely be shielded and to provide the forming method. SOLUTION: In a connection structure of a terminal, a cover 5 is arranged on a printed board 3 loading electronic parts 1 so that it covers the electronic parts 1. The cover 5 is formed of a flexible seat-like cover where an inner insulating layer 9 is bonded to an outer conductive layer 11. The insulating layer 9 is formed of an insulating resin film and the conductive layer 11 is formed of metal foil. A ground pattern 13 is formed on an upper face of the printed board 3 and a metallic projected terminal 15 is bonded to the ground pattern 13. A projection 19 of the terminal 15 passes through the insulating layer 9 and the conductive layer 11. The insulating layer 9 of the cover 5 is thermally fused to the printed board 3 at an outer peripheral part 7 positioned outside the electronic parts 1 for the whole periphery by including vicinity of the projection 19. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003298273(A) 申请公布日期 2003.10.17
申请号 JP20020101353 申请日期 2002.04.03
申请人 KITAGAWA IND CO LTD 发明人 YUMI HIDEO
分类号 H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K9/00
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