MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR INSPECTION DEVICE

摘要

PROBLEM TO BE SOLVED: To perform a burn-in inspection and a probe inspection at a wafer level even under a condition that a chip is divided into multiple pins, a test pad is turned to have a narrow pitch and a scribe region between adjacent chips is narrowed. SOLUTION: All the chips 51 within a wafer 4 to be inspected are covered by a semiconductor inspection device by a plurality of times of contacts of the device. By selecting the chips 51 to be inspected per contact by each other column within the main surface of the wafer 4 to be inspected for instance, all the chips 51 within the wafer 4 to be inspected can be covered by twice the contact. COPYRIGHT: (C)2004,JPO