| 摘要 |
PROBLEM TO BE SOLVED: To provide a measurement method and an apparatus for enhancing parallelism between the jet wave height of a flow soldering apparatus and a substrate to be soldered. SOLUTION: A measuring apparatus includes arms 4a and 4b freely movable in the width direction of the substrate to be soldered. Measuring terminals 6a, 6b, 6c and 6d which can indicate energization arranged at the tip parts of the arms are provided at both sides of the movable arms. The height of the movable arms is freely adjusted by using a vertically moving slider 2 provided separately, and the jet wave height and the parallelism relative to the substrate to be soldered can be confirmed. Since the measuring terminals are made to indicate energization, the jet wave height and the tilt of a solder tank can be automatically adjusted by a controller part provided separately. COPYRIGHT: (C)2004,JPO |
