A surface treatment system in which gas for a deposition reaction is injected into a deposition chamber and power is applied to form a deposition reaction to form a deposition layer at a surface of an object of surface treatment, wherein the deposition chamber has a plurality of deposition spaces disposed in parallel and a convey unit for conveying one or more objects of surface treatment to each deposition space or discharging the objects of surface treatment from each deposition space after a deposition reaction.
申请公布号
WO03083168(A1)
申请公布日期
2003.10.09
申请号
WO2002KR02471
申请日期
2002.12.28
申请人
LG ELECTRONICS INC.;CHO, CHEON-SOO;YOUN, DONG-SIK;LEE, HYUN-WOOK;HA, SAMCHUL;JUN, HYUN-WOO