| 摘要 |
<p>PURPOSE:To provide a resin-sealed semiconductor device in which the shapes of leads can be secured with high accuracy by suppressing the bending (lead skew) of the leads at the time of forming the leads and deformation of the leads is also secured at the time of handling or carrying a package. CONSTITUTION:The semiconductor device is constituted in such a way that a semiconductor chip 1 is mounted on a die pad 2 and the chip 1 is connected with lead pins 11 for electrically conducting the chip 1 and a circuit on an external printed board through metallic wires 4, and then, the chip 1 and parts of the pins 11 are molded with a sealing resin 5. Moreover, since the vicinities of the central parts of the pins 11 protruded from the resin 5 are fixed so as to connect adjacent pins 11 to each other, the bending of the pins 11 can be suppressed at the time of forming the pins 11 and handling and carrying the package.</p> |
