| 摘要 |
<p>The invention concerns a method for protecting chips (100) arranged on a wafer, comprising an active surface (101) whereon are provided the connection pads (120) for the chips, comprising steps which consist in: cutting out the wafer to loosen the chips (100); depositing an electrically insulating material (150) in the form of a thin layer, on the active surface and the flanks of at least one chip (100); clearing at least an opening (201) in the layer (150) at the pads (120) by cold welding of protuberances (200) or by laser engraving.</p> |
