| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a high density multilayer printed wiring board whose heat-resistivity, elasticity, and reliability are excellent in a laminate molding method. SOLUTION: A B stage resin composition layer is adhered to one side of a heat resistant film base material. As the B stage resin composition, (a) multi- functional cyanic acid ester monomer and cyanic acid ester pre-polymer 100 wt.pts are mixed by (b) fluid epoxy resin 15 to 500 wt.pts in a room temperature, and (c) heat curing catalyst 0.0005 to 10 wt.pts is mixed with (a+b)100 wt.pts. Laminate molding is carried out by using a heat-resistive film base material strengthening B stage resin composition sheet using a curing resin composition with the resin composition as necessary components, and then a metallic thin film is formed on the heat-resistant film to form a high density circuit. Therefore, it is possible to mold thin wire whose line/space is 25/25μm or less, and to obtain an adhesive sheet for a high density multilayer printed wiring board whose mechanical strength is high, whose bending, twisting, and thickness precision is excellent, and whose heat-resistivity and Z directional migration-resistivity or the like are excellent. COPYRIGHT: (C)2003,JPO |
