发明名称 Wiring board, method for manufacturing wiring board and electronic component using wiring board
摘要 A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided with an opening having predetermined pattern, a wiring formed with predetermined pattern on said insulating board, and an external terminal filled to said opening, connected with said wiring by said filling, and exposed to a bottom of said insulating board where said wiring is formed.
申请公布号 US2003178713(A1) 申请公布日期 2003.09.25
申请号 US20030348478 申请日期 2003.01.21
申请人 CHINDA AKIRA;MATSUURA AKIRA;YOSHIWA TAKAYUKI;MITA MAMORU;KAGEYAMA TAKASHI;TAGA KATSUTOSHI 发明人 CHINDA AKIRA;MATSUURA AKIRA;YOSHIWA TAKAYUKI;MITA MAMORU;KAGEYAMA TAKASHI;TAGA KATSUTOSHI
分类号 H01G2/06;H01L23/12;H05K1/11;H05K3/00;H05K3/40;H05K3/42;(IPC1-7):H01L23/02 主分类号 H01G2/06
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