发明名称 Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
摘要 The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N-R3, provided that R3 represents one of the following groups, Y represents SO2 or CO and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
申请公布号 US2003178138(A1) 申请公布日期 2003.09.25
申请号 US20030345166 申请日期 2003.01.16
申请人 TSUKAGOSHI ISAO;GOTOU YASUSHI;YUSA MASAMI;MIYADERA YASUO 发明人 TSUKAGOSHI ISAO;GOTOU YASUSHI;YUSA MASAMI;MIYADERA YASUO
分类号 B32B7/12;H05K3/30;H05K3/32;(IPC1-7):B32B15/04 主分类号 B32B7/12
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