发明名称 Method and apparatus for clamping used in molding applications
摘要 The invention of this patent is a method and apparatus used in molding applications. An external applied force causes an actuator rod to move in a linear motion. In turn, a rotary linkage rotates about its pivot point. This causes a series of linkage connectors to cause linkage arms to rotate around such linkage arms' pivot point. This rotary action causes platens to move simultaneously together to form a clean, even mold. While the platens move linearly on tie bars, which guide such linear movement, the linkage arms and rotary linkage are mounted on a mounting plate. This allows the clamping and applied force stresses on the platens to be dependent on the mounting plate, rather than the tie bars. The platens travel at the same speed and distance in relation to each other. The result is an evenly produced part that comprises two die or mold halves which are perfectly centered. This invention may be employed for injection molding, thermoforming, stretch blow molding, die stamping and the similar devices.
申请公布号 US2003175378(A1) 申请公布日期 2003.09.18
申请号 US20020098989 申请日期 2002.03.14
申请人 JANDURA JOHN 发明人 JANDURA JOHN
分类号 B29C33/22;B29C45/66;B29C49/56;B29C51/26;(IPC1-7):B29C33/20 主分类号 B29C33/22
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