发明名称 Method for making semiconductor device
摘要 A method for making a semiconductor device includes forming a resist pattern having a multi-layered structure by performing a plurality of development steps, the resist pattern including a first opening corresponding to a fine gate section of a gate electrode and a second opening placed on the first opening, the second opening corresponding to an over-gate section which is wider than the fine gate section and having a cross section protruding like an overhang, wherein every angle of the second opening at the tip of the over-gate section is more than 90 degrees; and forming the gate electrode provided with the fine gate section and the over-gate section by depositing electrode materials on the resist pattern.
申请公布号 US6620716(B2) 申请公布日期 2003.09.16
申请号 US20020114453 申请日期 2002.04.03
申请人 FUJITSU LIMITED;FUJITSU QUANTUM DEVICES LTD. 发明人 MAKIYAMA KOZO;OGIRI KATSUMI
分类号 G03F7/26;H01L21/027;H01L21/28;H01L21/285;H01L21/335;H01L21/338;H01L29/41;H01L29/423;H01L29/778;H01L29/812;(IPC1-7):H01L21/338 主分类号 G03F7/26
代理机构 代理人
主权项
地址
您可能感兴趣的专利