Solder paste stenciling apparatus for minimizing residue of solder paste,申请号GB20020005343-传众专利搜索

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发明名称	Solder paste stenciling apparatus for minimizing residue of solder paste
摘要
申请公布号	GB2386096(A)	申请公布日期	2003.09.10
申请号	GB20020005343	申请日期	2002.03.07
申请人	* COMPEQ MANUFACTURING COMPANY LIMITED	发明人	CHENG-YUAN * LIN;SHENG-LONG * WU;TE-CHANG * HUANG;HAO-WEI * LIANG;PIN-HSUAN * CHANG
分类号	H05K3/12;(IPC1-7):B41F15/12	主分类号	H05K3/12
代理机构		代理人
主权项
地址

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