| 摘要 |
<P>PROBLEM TO BE SOLVED: To allow a getter to be held with a simple structure, and to allow assembling to be facilitated, thereby reducing a cost. <P>SOLUTION: A recess 24 is provided on an upper surface of an outer peripheral wall 20a of a substrate 20, and a bulk type getter 23 is contained in the recess 24. The recess 24 is connected through a space 25 of a sealed state in which an infrared ray detecting element 1 is disposed, and a hole formed by partly cutting out the wall 20a. The substrate 20 is a ceramic package, and at a package molding time, the recess 24 and the hole are formed. The getter 23 absorbs a gas in the space 25 by irradiating with a laser beam through a window 21. <P>COPYRIGHT: (C)2003,JPO |
