发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To stabilize the sucking taking-out to be able to cope with a minimized electronic component by carrying out correction in accordance with a sucking taking-out level. <P>SOLUTION: A chip component A is supplied to a sucking taking-out position for a sucking nozzle 9. Setting operation for a upward/downward stroke of the sucking nozzle 9 is carried out while a mounting head 8 is being moved to a sucking station. Namely, because a measured value of the distance from a taking-out position C of a tape cassette 13 to the upper surface of the electronic component is already stored in an RAM 95 by a sensor 71, a CPU 93 as a control device calculates a downward stroke with reference to this measured value and controls the downward stroke of the sucking nozzle 9 by controlling a stroke motor 115 via an interface 90. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003249792(A) 申请公布日期 2003.09.05
申请号 JP20020049705 申请日期 2002.02.26
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 KURATA TAKESHI;KANO YOSHINORI;YAMAGUCHI HARUHIKO;KANAI TAKESHI
分类号 H05K13/04 主分类号 H05K13/04
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