| 摘要 |
<p>A composition for forming a silica based coating film which comprises (a) a siloxane resin such as an alkoxysilane resin, (b) a solvent capable of dissolving the siloxane resin, such as an alcohol, (c) an ammonium salt and the like, and (d) a thermally decomposable or volatile compound, and has curing characteristics wherein a coating film resulting from a heating treatment thereof at 150°C for 3 min exhibits a stress of 10 MPa and a silica based coating film obtained by final curing has a relative dielectric constant of less than 3.0. The composition for forming a silica based coating film provides a silica based coating film which is excellent in low dielectric property and adhesiveness, and also has satisfactory mechanical strength.</p> |
