| 摘要 |
The invention relates to a method of protecting a set of electronic, optoelectronic and/or electromechanical microcomponents (11) which are disposed at different locations on one face of a substrate wafer (10). The inventive method comprises the following steps, consisting in: providing a protective plate (20) comprising one face having more or less the same dimensions as the face of the substrate wafer; forming beads (24) of an adhesive material at positions that correspond to the locations of the microcomponents on the substrate wafer, said beads being spaced out according to a determined thickness and each bead surrounding the location of a microcomponent; applying the protective plate against the substrate wafer such that each bead surrounds a microcomponent and defines, together with the substrate wafer and the protective plate, a space which is closed off at the microcomponent; and cutting the protective plate into different pieces (32, 36) which each cover a microcomponent. |
