| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently obtain appropriate information on generated clusters by reviewing less defects when the defects are clustered and generated on a wafer. <P>SOLUTION: In a wafer-inspecting and a sampling system, wafer defects are detected and are stored in a data store as defect data. Information for indicating defective clusters on a wafer is also provided. The defects are sampled based on a statistical method, and a set of sampling defects are obtained. Additional data which facilitate an understanding of process errors are obtained by the succeeding detailed inspection and analysis of the details of the sampling defects. <P>COPYRIGHT: (C)2003,JPO |
