发明名称 |
Leadless flip chip carrier design and structure |
摘要 |
One disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die with a number of solder bumps on its active surface. The disclosed embodiment further comprises a printed circuit board attached to a bottom surface of the substrate. Another disclosed embodiment comprises at least one via in the substrate. The at least one via provides an electrical and thermal connection between a signal pad of the die and the printed circuit board. The at least one via provides an electrical connection between a substrate signal pad and the printed circuit board. The substrate signal pad is connected to the signal pad of the die by a signal solder bump. The at least one via also provides an electrical connection between the signal pad of the die and a land that is electrically connected to the printed circuit board.
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申请公布号 |
US6611055(B1) |
申请公布日期 |
2003.08.26 |
申请号 |
US20010877912 |
申请日期 |
2001.06.08 |
申请人 |
SKYWORKS SOLUTIONS, INC. |
发明人 |
HASHEMI HASSAN S. |
分类号 |
H01L23/367;H01L23/498;H01L23/64;H01L25/065;(IPC1-7):H01L23/10;H01L23/48 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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