| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost printed wiring board which solves the problem that in a conventional printed wiring board 1, a solder adhesion preventing layer 7 and a heat-resistant film 9 are arranged on a connecting land part 4 containing an angle part 2b so that a solder by automatic soldering will not adhere to the connecting land part 4, whereby the number of works is increased in arrangements in coatings and stickings of the solder adhesion preventing layer 7 and the heat-resistant film 9, and each releasing works after the automatic soldering, to form the printed wiring board at a higher cost. SOLUTION: There are provided an insulating substrate 2, a through-hole 3 formed in the insulating substrate, and connecting land parts 4 facing each other and provided along an outer periphery 3c, facing the through-hole of the insulating substrate. The through-hole comprises a center hole 3a and an escape hole 3b, continuously connecting in the outward direction of the center hole, and an angle part 2b is formed in the insulating substrate by the center hole and the escape hole and the connecting land part is not provided in the angle part. COPYRIGHT: (C)2003,JPO
|
