发明名称 Methods of patterning a multi-layer film stack and forming a lower electrode of a capacitor
摘要 A process for forming a multilayer film stack including a noble metal electrode and a multilayer barrier. The process includes exposing the film stack to a plasma formed of reactive species from an excitable gas mixture of argon, a chlorine bearing gas, a fluorine bearing gas and a carbon bearing gas. The method of forming the lower electrode of a capacitor includes simultaneously etching a multilayer barrier and an electrode layer.
申请公布号 US2003143803(A1) 申请公布日期 2003.07.31
申请号 US20030358410 申请日期 2003.02.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ATHAVALE SATISH D.;COSTRINI GREG
分类号 H01L21/02;H01L21/3213;H01L21/8242;H01L21/8246;(IPC1-7):H01L21/824 主分类号 H01L21/02
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