| 摘要 |
The present invention provides a method and apparatus for processing substrates. A processing system includes a chamber having a top mounted pumping assembly. The chamber comprises a ceiling disposed on a chamber body and having an opening formed therein. The pumping assembly is connected to the ceiling and registered with the opening. The pumping assembly operates to evacuate the chamber to a desired pressure. One or more gases are supplied to the chamber via a gas distribution chamber and are exhausted from the chamber via the opening formed in the ceiling.
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