发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
A semiconductor device comprises: a semiconductor chip; a base metal lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; copper wires to directly connect electrodes on said semiconductor chip to the inner ends of said plurality of leads; and a resin molded member to hermetically seal said semiconductor chip, a large proportion of said lead frame and said copper wires. A method of manufacturing a semiconductor device comprises: preparing a base metal lead frame including a die pad and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; applying a non-benzotriazole series rustproof agent on the surface of said lead frame; performing die-bonding for fixing a semiconductor chip onto said die pad in a heated atmosphere by use of a non-metal series paste; performing wire-bonding to connect said electrodes on said semiconductor chip to the inner ends of said leads of said lead frame by use of copper wires; forming resin molded member by sealing said lead frame with a resin excluding some portions of said leads; and forming leads protruding from said resin molded member.
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申请公布号 |
US2003116837(A1) |
申请公布日期 |
2003.06.26 |
申请号 |
US20020194296 |
申请日期 |
2002.07.15 |
申请人 |
FUKATANI TADAO;MASUDA HIROSHI;MOTONAMI KOJI |
发明人 |
FUKATANI TADAO;MASUDA HIROSHI;MOTONAMI KOJI |
分类号 |
H01L23/28;H01L21/48;H01L21/52;H01L23/495;H01L23/50;(IPC1-7):H01L21/44;H01L23/02;H01L29/40 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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