AN ELECTRONIC ASSEMBLY AND A METHOD FOR MANUFACTURING THE SAME

摘要

An electronic assembly and a method of manufacturing such an assembly in which a carrier (13) for electronic components (14) and leads (18) for external connection are connected with each other by interconnections (19) including solder joints (22). In order to sustain heating periods, at least one of said interconnections comprises an adhesive joint (23) in addition to the solder joint applied between the carrier and one lead.