| 发明名称 |
METHOD AND APPARATUS FOR ENCODING INFORMATION IN AN IC PACKAGE |
| 摘要 |
An integrated circuit (IC) package includes a substrate, a ground line, and an encoded region. The encoded region provides information based upon selective deposition of solder balls electrically coupled to the ground line.
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| 申请公布号 |
US2003116868(A1) |
申请公布日期 |
2003.06.26 |
| 申请号 |
US19990470092 |
申请日期 |
1999.12.21 |
| 申请人 |
HORIGAN JOHN W.;MORESCO LARRY L. |
发明人 |
HORIGAN JOHN W.;MORESCO LARRY L. |
| 分类号 |
H01L23/544;H05K1/02;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/544 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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