发明名称 High resistivity silicon wafer with thick epitaxial layer and method of producing same
摘要 A silicon wafer having a thick, high-resistivity epitaxially grown layer and a method of depositing a thick, high-resistivity epitaxial layer upon a silicon substrate, such method accomplished by: a) providing a silicon wafer substrate and b) depositing a substantially oxygen free, high-resistivity epitaxial layer, with a thickness of at least 50 mum, upon the surface of the silicon wafer. The silicon wafer substrate may then, optionally, be removed from the epitaxial layer.
申请公布号 US6583024(B1) 申请公布日期 2003.06.24
申请号 US20010008440 申请日期 2001.12.06
申请人 SEH AMERICA, INC. 发明人 KONONCHUK OLEG V.;KOVESHNIKOV SERGEI V.;RADZIMSKI ZBIGNIEW J.;WEAVER NEIL A.
分类号 C30B25/02;C30B33/00;H01L21/205;(IPC1-7):H01L21/76 主分类号 C30B25/02
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